カーリルで「author:Liu, J. J.」を検索

Multimedia fingerprinting forensics for traitor tracing

K. J. Ray Liu, Wade Trappe, Z. Jane Wang, Min Wu, and Hong Zhao

Hungarian problem book III : based on the Eötvös Competition, 1929-1943

compiled by G. Hájos, G. Neukomm, and J. Surányi ; translated and edited by Andy Liu

The American faculty : the restructuring of academic work and careers

Jack H. Schuster, Martin J. Finkelstein : in collaboration with Jesus Francisco Galaz-Fontes, Mandy Liu

The American faculty : the restructuring of academic work and careers

Jack H. Schuster, Martin J. Finkelstein : in collaboration with Jesus Francisco Galaz-Fontes, Mandy Liu

Sexual behavior in modern China : report on the nationwide survey of 20,000 men and women

Dalin Liu, Man lun Ng, Li Ping Zhou, and Erwin J. Haeberle ; English-language edition by Man lun Ng and Erwin J. Haeberle

Business and safety issues in the commercialization of nanotechnology : symposia held November 29-December 2, 2009, Boston, Massachusetts, U.S.A.

editors, Sympoisum P, Loucas Tsakalakos ... [et al.] ; Symposium YY, Thomas J. Webster, Huinan Liu, Robert Hurt

中国海洋生物名录 = Checklist of marine biota of China seas

刘瑞玉主编 ; 中国科学院海洋研究所编辑 = editor, Liu Ruiyu (J.Y. Liu) ; edited by Institute of Oceanology, Chinese Academy of Sciences

Computational techniques for contact, impact, penetration, and perforation of solids : presentead at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989

sponsored by the Applied Mechanics Division, ASME ; edited by L.E. Schwer, N.J. Salamon, and W.K. Liu

Proceedings of the International Summer School on Heavy Ion Reaction Theory, Lanzhou, China, 10-18 August 1988

editors, W.Q. Shen, J.Y. Liu, L.X. Ge ; sponsors, Institute of Modern Physics, Academia Sinica, Institute of Atomic Energy, Lanzhou University

Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu