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Mems Packaging (Wspc Series In Advanced Integration And Packaging Book 5) (English Edition)

Y C Lee／Yu-Ting Cheng／Ramesh Ramadoss／Yung-cheng Lee／Yu-ting Cheng／Ramesh Ramadoss

Micro-Optics Integration and Assemblies

Feldman, Michael R.／Lee, Yung-Cheng

Optoelectronic Packaging (Wiley Series in Microwave and Optical Engineering)

Mickelson, Alan Rolf／Basavanhally, Nagesh R.／Lee, Yung-Cheng

Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee

Optoelectronic packaging : 1-2 February 1996, San Jose, California

Michael R. Feldman, Yung-Cheng Lee, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cooperating organization, ARPA, Advanced Research Projects Agency

Physics design-reliability and packaging

edited by E. Suhir, Y. C. Lee, C. P. Wong

Manufacturing challenges in electronic packaging

edited by Y.C. Lee and W.T. Ch

Aquaculture economic analysis : an introduction

by Yung C. Shang