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Chiplet Design and Heterogeneous Integration Packaging
Lau, John H.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Lau, John H.
Chip Scale Packaging: Design, Materials, Processes and Realiablity, and Applications (McGraw-Hill Electronic Packaging and Interconnection Series)
Lau, John H.／Lee, Ricky S. W.／Lee, Shi-Wei Ricky
Electronic Packaging: Design, Materials, Process, and Reliability (Electronic Packaging and Interconnection)
Lau, John H.／Nakayama, Wataru／Prince, J. L.／Wong, Christine P. W.
Flip Chip Technologies (Electronic Packaging and Interconnection Series)
Lau, John H.
Ball Grid Array Technology (Electronic Packaging and Interconnection Series)
Lau, John H.
3D IC integration and packaging
John H. Lau
Chiplet design and heterogeneous integration packaging
John H. Lau
Heterogeneous integrations
John H. Lau
Semiconductor advanced packaging
John H. Lau

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