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Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (1 & 2)

Garrou, Philip／Bower, Christopher／Ramm, Peter

Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set)

Garrou, Philip／Bower, Christopher／Ramm, Peter

Enabling Technologies for 3-D Integration: Volume 970 (MRS Proceedings)

Bower, Christopher A.／Garrou, Philip E.／Ramm, Peter／Takahashi, Kenji

Multichip Module Technology Handbook (Electronic Packaging and Interconnection Series)

Garrou, Philip E.／Turlik, Iwona

3D process technology

edited by Philip Garrou, Mitsumasa Koyanagi and Peter Ramm

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 14-17, 1999

co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.] ; technical chairs, Philip Garrou, James E. Morris

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 6-8, 2000

co-sponsored by International Microelectronics and Packaging Society (IMAPS) ... [et al.] ; general chair, C.P. Wong ... [et al.] ; technical chairs, Philip Garrou, James E. Morris

Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A.

editors, Fred Roozeboom ... [et al.]